Kinsus Interconnect Technology Corp.

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6 documents for Kinsus Interconnect Technology Corp.

- Research and Markets: Global and China Advanced Packaging Industry Report, 2009-2010.
... technologies in 2010, the popular TSV technology makes slow progress. TSV has to solve quite a few ...(ASE Inc.). * Kinsus Interconnect Technology Corp. * Nan Ya PCB Corpora...
- Business Wire
- October 05, 2010
- Tessera Licenses oPILR Technology to Kinsus.
oPILR Interconnect Platform Improves Semiconductor Packaging Size, Pe... that Kinsus Interconnect Technology Corp. has licensed Tessera's oPILR[TM] interconnect pla...
- Business Wire
- February 10, 2009
- Key Challenges and Issues Facing The IC Advanced Packaging Industry Report, 2007.
...However, as technology advances, the proportion of packaging cost to the ... 5.5 PPT (Phoenix Precision Technology Corporation) . 5.6 Nan Ya PCB . 5.7 Kinsus (Kinsus Interconnec...
- Business Wire
- January 10, 2008

- The Market Scale of Outsourced IC Packaging, as Estimated, is to Grow up to USD13.1 billion in 2006.
... of one semiconductor unit; however, as technology advances, the proportion of packaging cost to the ...) - PPT (Phoenix Precision Technology Corporation) - Nan Ya PCB - Kinsus (Kinsus Interconnect Techno...
- Business Wire
- November 08, 2006
- The Prices Of Semiconductors Are Fluctuating Because Of The Continual Advent Of New Products And The Shortened Lifecycle.
... of one semiconductor unit; however, as technology advances, the proportion of packaging cost to the ...* -PPT (Phoenix Precision Technology Corporation) . * -Nan Ya PCB . * -Kinsus (Kinsus Interconnect ...
- Business Wire
- November 17, 2006
- New Report Examines the Challenging IC Advanced Packaging Industry.
...However, as technology advances, the proportion of packaging cost to the ...-PPT (Phoenix Precision Technology Corporation) . -Nan Ya PCB . -Kinsus (Kinsus Interconnect Tech...
- Business Wire
- January 15, 2008